A Vector Network Analyser can characterize the electrical response of radio frequency and microwave electrical networks and devices by applying an electrical signal of specific frequency (with up to 4 input/output ports) and measuring the reflected and transmitted signals; coupled with an external magnet performs ferromagnetic resonance analysis.

The Spreading Resistance Profiling is a methodology for measuring resistance profiles and, following calibration, the density profiles of active carriers in state-of-the-art semiconductor geometries. Two metallic probes, between which a controlled potential is applied, are used to quantify the charge carrier distributions as a function of depth.

Ultraviolet lithography also known as optical or photolithography is the most commonly used patterning technique in microfabrication. A photosensitive material (photoresist) is spin-coated onto the substrate to be patterned. The photoresist is illuminated with UV light through a photomask which contains the relevant geometric patterns.

Chemical vapor deposition (CVD) is the generic name for a group of chemical processes that allow the synthesis of thin films trough chemical reactions between gaseous precursor/s and a substrate kept at a given temperature. The process is often used in the semiconductor industry to produce high quality, high-performance solid materials.

Atomic layer deposition (ALD) precisely controls thin film thickness at the atomic level. This technique sequentially exposes a substrate to gas-phase precursors, enabling the formation of a single atomic layer per cycle. Its uniformity and conformality make it ideal for semiconductors, solar cells, and nanotechnology.

Direct Writing lithography (DWL) is a Maskless lithography technique in which the pattern is transferred directly onto the surface of the wafer without the need of a photomask. A direct laser writer, guided by a control computer, “writes” the patterns that conform one layout level directly onto the resist-covered substrates.

TEMPORARILY UNAVAILABLE Reactive Ion Etching (RIE) is a dry etching technique used in the fabrication of micro- and nanodevices. RIE utilizes reactive gases in a plasma state, combining the chemical reactivity of reactive species with the physical bombardment of energetic ions, to achieve highly anisotropic and selective etching of materials.

Photocurrents induced by short laser pulses can give information on the response time of photoconductivity and thus on free carrier lifetimes, the influence of deep and shallow traps, charge carrier mobility and also on the degree of disorder of the system. The measurement of transient photocurrents is called Time of Flight (TOF) technique.

CELIV is a popular technique usually used to estimate charge carrier mobility in organic and perovskite based optoelectronic devices. A displacement current generated by an external trigger can be recorded and used to extract significant information about the materials, such as mobility, doping, relative permittivity, recombination coefficient.

Spectroscopic Ellipsometry (SE) is a contact-free, nondestructive method for the characterization of the dielectric and optical properties (refractive index, absorption coefficient, anisotropy) and structural properties (roughness, thickness and intermix of layers) in the thickness range of < 1 nm to few µm.

X-ray Reflectivity (XRR) is a grazing incidence X-ray scattering technique sensitive to surface electron densities. It is used to characterise flat, smooth surfaces and layered samples, providing information about thickness, roughness, electronic density of materials and the related refractive index.

XRD is a non-destructive technique used to analyse the structural order of crystalline materials. By measuring the scattering of X-rays at various angles, XRD can determine interplanar distances, extract structural information, identify and quantify the weight fraction of different crystal phases in polymorphic specimens.

Dicing is typically used to separate die from a wafer to be mounted in a package or on a PC board. It can be used to cut a wide range of materials and devices including Semiconductor devices, Ceramic Substrates, Thick-film Devices, Sensors, MEMS, Opto-electronic Components, IC Wafers.

Electrochemical deposition or electroplating is a technique used to coat a conductive surface with a metal layer. By immersing the substrate into an electrolyte solution and applying an electric current, metal ions are reduced and deposited onto the substrate. This method ensures uniform coatings with controlled thickness and composition.

Wafer bonding is a packaging technology on wafer-level. It’s an essential process step for the fabrication of microelectromechanical systems, nanoelectromechanical systems, microelectronics and optoelectronics. It provides the possibility to realize real three-dimensional systems, ensuring a mechanically stable and hermetically sealed encapsulation